JSR and IBM’s AI Pact Promises a Breakthrough in Chip Materials

JSR Corporation and IBM have entered into a joint research agreement to advance semiconductor materials development using artificial intelligence, signalling a major leap in digital transformation for the global electronics and chemical sectors.

The collaboration will establish an AI-driven platform that integrates generative AI and foundational models designed for materials science.

This system aims to streamline the discovery and optimization of complex semiconductor materials, enhancing efficiency and enabling faster innovation cycles.

“We are very pleased to further expand our long history of collaboration with JSR,”

Said Tsuyoshi Fukuda, Executive Officer, Research and Development, and Director at IBM Research – Tokyo.

“By combining JSR’s decades of expertise in materials science with IBM’s AI capabilities, we hope to unlock new discoveries and accelerate next-generation materials development.”

“The fusion of digital technology and materials science offers a great opportunity to create unprecedented value,”

Said Toru Kimura, Senior Executive Officer at JSR.

“Through this joint research, we aim to accelerate the development of innovative materials and contribute to industry-wide progress.”

For over 25 years, JSR and IBM have worked together on research initiatives that combine AI and semiconductor innovation.

This new phase strengthens their long-term collaboration by focusing on data-driven modelling and real-time material simulation.

As semiconductor technologies evolve rapidly, the partnership highlights how AI is becoming a central driver of discovery, performance, and sustainability across the chip manufacturing ecosystem.

Further updates will follow as IBM and JSR advance their joint AI materials platform and testing phases.